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Знаете ли вы о эпоксидной смоле для высокоэффективных электронных упаковочных материалов?

May 29, 2024, 11:58 AM
TDDchem.com
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Electronic packaging adhesive is essential for sealing and protecting electronic devices from environmental factors. Epoxy resin stands out due to its excellent heat resistance, electrical insulation, and mechanical properties, making it ideal for semiconductor encapsulation. With the growing demand for environmentally friendly materials, future developments will focus on enhancing epoxy resin's performance and production processes.
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